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Availability of Small Outline packages in an SnPb Plated version will be limited and most will be phased out. Lead Free Finish on many large
The NanjingGlass Passivation Process (GPP) for Rectifier Dice occurs in the wafer form after the Wafer Diffusion (P+) Process.Immediately af
Nanjingmanufactures its dual transistor products using separate die which are wire bonded to the lead frames. They are not monolithic device
Customers may continue to buy products that have not been "converted" subject to availability in either format, with SnPb Lead Finish or Lea
南晶使用分立的管芯制造其双晶体管产品,这些管芯引线接合到引线框架。 它们不是单片器件。
The Finish will be backward compatible with Pb containing solders. Conversely, the current product with SnPb Lead Finish can be used with Pb
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