TYPE: | ES1BF | IO: | 1A | IR: | 5uA |
PIV: | 100V | VFM: | 0.95V | TRR: | 35ns |
FEATURES
•For surface mounted applications
• Low profile package
• Glass Passivated Chip Junction
• Superfast reverse recovery time
• Lead free in comply with EU RoHS 2011/65/EU directives
• Low profile package
• Glass Passivated Chip Junction
• Superfast reverse recovery time
• Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
•Case: SMAF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 27mg / 0.00095oz
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 27mg / 0.00095oz
Tel:0769-81837972 Fax:0769-81837971 E-mail:nanjing@gdnjdz.com